• 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
  • 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
  • 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
  • 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
  • 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
  • 3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU

3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU

Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate, High Temperature, LED,CPU,TV,PCB,PC,PDP Chip etc
Type: Insulation Sheet
Chemistry: Silica Gel
Material: Thermal Interface Silicone Material
Thermal Rating: -45~+220 Degree Celsius
Maximum Voltage: 20KV~100KV
Samples:
US$ 1/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Gold Member Since 2021

Suppliers with verified business licenses

Rating: 5.0/5
Guangdong, China
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Basic Info.

Model NO.
XLF-300
Classification
Silica Gel Thermal
Certification
ISO9001, RoHS/SGS
Color
Grey,Black,White,Pink,Blue etc
Brand
Xinlongfei
Place of Origin
Guangdong, China
Model Number
Xlf-300
Tensile Strength
8-55kg/Cm2
Rated Voltage
10kv
Thickness
0.3mm-10.0mm
Working Temperature
-45~+220 Degree Celsius
Thermal Conductivity
0.8~15.0W/M-K
Density (g/cm3)
1.4-3.1
Flame Rating
UL-94 V-0
Type Name
Silica Gel Thermal
Transport Package
with Release Liner and Packed with Carton Box
Specification
Customized according to customer size and shape
Trademark
Xinlongfei
Origin
China
HS Code
3506100090
Production Capacity
300000 Piece/Pieces Per Month

Product Description

Product Description                                                                                                                                                                                                  

Thermal interface silicone material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving.

With nice stickiness,flexibility, good compression performance and excellent heat conductivity designed for it,it makes the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

Thermal Pad Properties:
Typical Propertuse:
Items
                                                                              Thermal Pad                                                                    
Product Models
XLF-600
XLF-500
XLF-400
XLF-300
XLF-200
XLF-100
Unit
Test Standard
Color
customizable
customizable
customizable
customizable
customizable
customizable
-------
Visual
Thickness
0.3-6.5
0.3-6.5
0.3-8.0
0.3-20
0.3-20
0.3-20
-------
ASTM D374
Hardness
    35
(±5)
     35
(±5)
    35 (±5)
    35 (±5)
    35 (±5)
    35 (±5)
Shore C
ASTM D2240
Density
  3.5
(±0.3)
 3.5 (±0.3)
 3.4 (±0.3)
 3.2
(±0.3)
 2.3 (±0.3)
 2.2
(±0.3)
g/cc
ASTM D792
Tensile Strength
≥0.3
≥0.3
≥0.31
≥0.33
≥0.39
≥0.5
Mpe
ASTM D412
Elongation
≥20
≥20
≥30
≥35
≥50
≥60
%
ASTM D412
Flammability Rating
V-0
V-0
V-0
V-0
V-0
V-0
-------
UL-94
Continuous Use Temperature
-40-±200
-40-±200
-40-±200
-40-±200
-40-±200
-40-±200
 
ºC
 
EN334
Thermal Conductivity                                                                                                                                                                               
Thermal Conductivity
6
5
4
3
2
1
W/m-k
ASTM D5470
Electrical Properties                                                                                                                                                                                 
Breakdowm Voltage
≥5
≥5
≤6
≤6
≤6
≤6
kv/mm
ASTM D149
Volume Resistivity
≥1.6*10^11
≥2.0*10^11
≥1.9*10^10
≥1.8*10^11
≥1.8*10^9
≥1.8*10^10
Ω.cm
ASTM D257
Dielectric Constant
≥6.5
≥6.5
≥6.5
≥6.5
≥6.5
≥6.5
@1MHz
ASTM D150
Note: the conventional thermal conductivity is 1-8w / m-k, the thickness is 0.3-30mm, and other requirements can be customized  

Applications:
1.LED lighting, lighting equipment
2.Household appliances LCD display
3.Between semiconductor and heat sink
4.Communication product, smart phone, tablet .
5.Desktop, notebook and other portable computer
6.Large power supply etc.

Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient1,1.5,2.5,3.6,4.6,5.2, 7,8,10,11,13,15W/m-k
2.Stable performance, low thermal resistance, effectively improve the heat transfer speed
3.Low hardness, its viscosity high, easy to use
4.V-O certification standards


3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPUWe provide various customized services according to your needs!
Customer first is our business philosophy, and quality assurance is the foundation of our service.
 
3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
Our Services                                                                                                                                                                                                                 

Thermal interface silicone material is our core competencies!

 

 1:Competitive advantage products

 2:Full payment refund in case of bad quality

 3:Confidentiality agreement(business contract)

 4:Quality assurance contract

 5:Free sample offer & small order welcomed

 6:Payment by Paypal

 7:After sale service 24*6

3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
Company Information                                                                                                                                                                                                 

Shenzhen Xinlongfei electronic products Co.,Ltd is a professional-friendly electronic thermal interface material manufacturer,established in 1996.

We mainly produce high conductivity thermal interface silicone material, thermal double-sided tape, thermal graphite,thermal conductive potting,thermal grease,silicone heat sinks etc.

With good quality product and nice price&service, we have successfully expanded our market throughout Europe, North America, Latin America, the Middle East and the Asia-Pacific region.Wish you will be our our next long term cooperation customer.
3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU
FQA                                                                                                                                                                                                            

1:Are you trade company or manufacturer?

We are China professional manufacturer of customized various thermal interface materials,such as thermal interface silicone material,thermal conductive tape,thermals conductive graphite etc with mre than 15years experience in this line.

 

2:Why price is so low?

You are order from factory botton price!

 

3:How can you guarantee the quality?

With advanced production machine and testing equipment,we ensure 100% quality inspection before shipping.

 

4:What's the leading time?

Sample order costs 1~3workdays and 5~7 working days for mass production.

 

5:Can i take sample?

We are honored to provide you sample for testing.

 

6:What payment term is available?

We can accept L/C,TT,Paypal.West Union.

 

Related thermal interface silicone material you may interest ,pls feel free to contact with me
 

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3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU3.6W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop LED CPU GPU



 

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